JPH0546897Y2 - - Google Patents

Info

Publication number
JPH0546897Y2
JPH0546897Y2 JP1989004826U JP482689U JPH0546897Y2 JP H0546897 Y2 JPH0546897 Y2 JP H0546897Y2 JP 1989004826 U JP1989004826 U JP 1989004826U JP 482689 U JP482689 U JP 482689U JP H0546897 Y2 JPH0546897 Y2 JP H0546897Y2
Authority
JP
Japan
Prior art keywords
mold
station
resin
lower molds
tablet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989004826U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0297009U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989004826U priority Critical patent/JPH0546897Y2/ja
Publication of JPH0297009U publication Critical patent/JPH0297009U/ja
Application granted granted Critical
Publication of JPH0546897Y2 publication Critical patent/JPH0546897Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989004826U 1989-01-19 1989-01-19 Expired - Lifetime JPH0546897Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989004826U JPH0546897Y2 (en]) 1989-01-19 1989-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989004826U JPH0546897Y2 (en]) 1989-01-19 1989-01-19

Publications (2)

Publication Number Publication Date
JPH0297009U JPH0297009U (en]) 1990-08-02
JPH0546897Y2 true JPH0546897Y2 (en]) 1993-12-09

Family

ID=31207681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989004826U Expired - Lifetime JPH0546897Y2 (en]) 1989-01-19 1989-01-19

Country Status (1)

Country Link
JP (1) JPH0546897Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold
JPS57105333A (en) * 1980-12-23 1982-06-30 Akashi Plast Kogyo Kk Automatic compression molding device for molding tehrmosetting resin
JPS649712A (en) * 1987-07-02 1989-01-13 Rohm Co Ltd Resin molding device

Also Published As

Publication number Publication date
JPH0297009U (en]) 1990-08-02

Similar Documents

Publication Publication Date Title
US5891483A (en) Automatic molding machine using release film
KR0164440B1 (ko) 전자부품의 수지봉지성형방법 및 장치
CN100483657C (zh) 树脂模制机
JP6320448B2 (ja) 樹脂封止装置および樹脂封止方法
KR102408581B1 (ko) 수지 몰딩 장치 및 수지 몰딩 방법
JPH0546897Y2 (en])
CN100366414C (zh) 树脂封止成形装置
JP2567603B2 (ja) 連続自動樹脂封止方法
JP3911402B2 (ja) 半導体封止装置
JP2004140047A (ja) 樹脂封止装置
JP2932137B2 (ja) 電子部品の樹脂封止成形方法及び装置
JP3524982B2 (ja) 半導体モールド装置
JPH0535658B2 (en])
JP2840815B2 (ja) 電子部品の樹脂封止成形装置
KR20000009145A (ko) 반도체 팩키지용 자동몰딩장치
KR102441695B1 (ko) 왁스패턴 제작장치
KR102441697B1 (ko) 왁스패턴 제작방법
JP2666041B2 (ja) 電子部品の樹脂封止成形方法
JP3005875B2 (ja) 樹脂モールド装置
JP2004179283A (ja) 樹脂成形用金型への供給方法と取出方法及び供給機構と取出機構
JPH0142343Y2 (en])
JPH09201842A (ja) 金型循環式トランスファー成形法,半導体装置の製造方法,金型循環式トランスファー成形装置及び半導体装置の樹脂封止成形装置
TW202333246A (zh) 樹脂密封裝置、樹脂密封方法及樹脂成形方法
JP3525036B2 (ja) 電子部品の樹脂封止成形方法
JPS63184344A (ja) 半導体製造装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term